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STM32F103CBU6TR 数据表(PDF) 8 Page - STMicroelectronics |
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STM32F103CBU6TR 数据表(HTML) 8 Page - STMicroelectronics |
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8 / 92 page ![]() List of figures STM32F103x8, STM32F103xB 8/92 Doc ID 13587 Rev 11 Figure 42. Recommended footprint(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 Figure 43. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package outline . . . . . . . . . . 79 Figure 44. Recommended PCB design rules for pads (0.5 mm pitch BGA) . . . . . . . . . . . . . . . . . . . . 80 Figure 45. LQFP48, 7 x 7 mm, 48-pin low-profile quad flat package outline . . . . . . . . . . . . . . . . . . . . 81 Figure 46. Recommended footprint(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 Figure 47. LQFP100 PD max vs. TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84 |
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