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STM32F103CBU6TR 数据表(PDF) 90 Page - STMicroelectronics |
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STM32F103CBU6TR 数据表(HTML) 90 Page - STMicroelectronics |
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90 / 92 page ![]() Revision history STM32F103x8, STM32F103xB 90/92 Doc ID 13587 Rev 11 21-Jul-2008 8 Power supply supervisor updated and VDDA added to Table 9: General operating conditions. Capacitance modified in Figure 12: Power supply scheme on page 33. Table notes revised in Section 5: Electrical characteristics. Table 16: Typical and maximum current consumptions in Stop and Standby modes modified. Data added to Table 16: Typical and maximum current consumptions in Stop and Standby modes and Table 21: Typical current consumption in Standby mode removed. fHSE_ext modified in Table 20: High-speed external user clock characteristics on page 48. fPLL_IN modified in Table 27: PLL characteristics on page 53. Minimum SDA and SCL fall time value for Fast mode removed from Table 39: I2C characteristics on page 62, note 1 modified. th(NSS) modified in Table 41: SPI characteristics on page 64 and Figure 27: SPI timing diagram - slave mode and CPHA = 0 on page 65. CADC modified in Table 45: ADC characteristics on page 68 and Figure 32: Typical connection diagram using the ADC modified. Typical TS_temp value removed from Table 49: TS characteristics on page 72. LQFP48 package specifications updated (see Table 55 and Table 46), Section 6: Package characteristics revised. Axx option removed from Table 57: Ordering information scheme on page 85. Small text changes. 22-Sep-2008 9 STM32F103x6 part numbers removed (see Table 57: Ordering information scheme). Small text changes. General-purpose timers (TIMx) and Advanced-control timer (TIM1) on page 15 updated. Notes updated in Table 5: Medium-density STM32F103xx pin definitions on page 26. Note 2 modified below Table 6: Voltage characteristics on page 34, | V DDx| min and |VDDx| min removed. Measurement conditions specified in Section 5.3.5: Supply current characteristics on page 38. IDD in standby mode at 85 °C modified in Table 16: Typical and maximum current consumptions in Stop and Standby modes on page 42. General input/output characteristics on page 57 modified. fHCLK conditions modified in Table 30: EMS characteristics on page 55. JA and pitch value modified for LFBGA100 package in Table 56: Package thermal characteristics. Small text changes. Table 58. Document revision history (continued) Date Revision Changes |
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