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MPC8378CVRALDA 数据表(PDF) 117 Page - Freescale Semiconductor, Inc |
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MPC8378CVRALDA 数据表(HTML) 117 Page - Freescale Semiconductor, Inc |
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117 / 126 page ![]() MPC8378E PowerQUICC™ II Pro Processor Hardware Specifications, Rev. 2 Freescale Semiconductor 117 Thermal Table 77 shows the heat sink thermal resistance for TePBGA II package with heat sinks, simulated in a standard JEDEC environment, per JESD 51-6. Heat sink vendors include the following: Aavid Thermalloy www.aavidthermalloy.com Alpha Novatech www.alphanovatech.com International Electronic Research Corporation (IERC) www.ctscorp.com Millennium Electronics (MEI) www.mei-thermal.com Table 77. Thermal Resistance with Heat Sink in Open Flow (TePBGA II) Heat Sink Assuming Thermal Grease Air Flow Thermal Resistance ( °/W) AAVID 30 × 30 × 9.4 mm Pin Fin Natural Convection 13.1 0.5 m/s 10.6 1 m/s 9.3 2 m/s 8.2 4 m/s 7.5 AAVID 31 × 35 × 23 mm Pin Fin Natural Convection 11.1 0.5 m/s 8.5 1 m/s 7.7 2 m/s 7.2 4 m/s 6.8 AAVID 43 × 41× 16.5mm Pin Fin Natural Convection 11.3 0.5 m/s 9.0 1 m/s 7.8 2 m/s 7.0 4 m/s 6.5 Wakefield, 53 × 53 × 25 mm Pin Fin Natural Convection 9.7 0.5 m/s 7.7 1 m/s 6.8 2 m/s 6.4 4 m/s 6.1 |
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