CPC7594

18

www.clare.com

R03

3. Manufacturing Information

3.1 Mechanical Dimensions

3.1.1 DFN

3.1.2 SOIC

EXPOSED

METALLIC PAD

7.00 ± 0.25

(0.276 ± 0.01)

6.00 ± 0.25

(0.236 ± 0.01)

INDEX AREA

TOP VIEW

SEATING

PLANE

SIDE VIEW

0.90 ± 0.10

(0.035 ± 0.004)

0.30 ± 0.05

(0.012 ± 0.002)

0.02, + 0.03, - 0.02

(0.0008, + 0.0012, - 0.0008)

0.20

(0.008)

4.25 ± 0.05

(0.167 ± 0.002)

0.55 ± 0.10

(0.022 ± 0.004)

6.00 ± 0.05

(0.236 ± 0.002)

BOTTOM VIEW

Dimensions

mm

(inch)

Terminal Tip

0.80

(0.032)

16

1

0.406 ± 0.076

(0.016 ± 0.003)

10.211 ± 0.254

(0.402 ± 0.010)

7.493 ± 0.127

(0.295 ± 0.005)

10.312 ± 0.381

(0.406 ± 0.015)

1.270 TYP

(0.050 TYP)

0.254 MIN / 0.737 MAX X 45°

(0.010 MIN / 0.029 MAX X 45°)

0.2311 MIN / 0.3175 MAX

(0.0091 MIN / 0.0125 MAX)

0.889 ± 0.178

(0.035 ± 0.007)

0.649 ± 0.102

(0.026 ± 0.004)

PIN 1

PIN 16

2.540 ± 0.152

(0.100 ± 0.006)

(inches)

mm

DIMENSIONS

NOTES:

1. Coplanarity = 0.1016 (0.004) max.

2. Leadframe thickness does not include solder plating (1000 microinch maximum).

2.337 ± 0.051

(0.092 ± 0.002)

0.203 ± 0.102

(0.008 ± 0.004)