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MPC8544EBVTALF 数据表(PDF) 34 Page - Freescale Semiconductor, Inc |
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MPC8544EBVTALF 数据表(HTML) 34 Page - Freescale Semiconductor, Inc |
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34 / 120 page ![]() MPC8544E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 34 Freescale Semiconductor Enhanced Three-Speed Ethernet (eTSEC), MII Management Figure 14 provides the AC test load for eTSEC. Figure 14. eTSEC AC Test Load Figure 15 shows the GMII receive AC timing diagram. Figure 15. GMII Receive AC Timing Diagram 8.6 MII AC Timing Specifications This section describes the MII transmit and receive AC timing specifications. RX_CLK clock fall time (80%–20%) tGRXF —— 1.0 ns — Note: 1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tGRDVKH symbolizes GMII receive timing (GR) with respect to the time data input signals (D) reaching the valid state (V) relative to the tRX clock reference (K) going to the high state (H) or setup time. Also, tGRDXKL symbolizes GMII receive timing (GR) with respect to the time data input signals (D) went invalid (X) relative to the tGRX clock reference (K) going to the low (L) state or hold time. Note that, in general, the clock reference symbol representation is based on three letters representing the clock of a particular functional. For example, the subscript of tGRX represents the GMII (G) receive (RX) clock. For rise and fall times, the latter convention is used with the appropriate letter: R (rise) or F (fall). Table 31. GMII Receive AC Timing Specifications (continued) At recommended operating conditions with L/TVDD of 3.3 V ± 5% or 2.5 V ± 5% Parameter/Condition Symbol1 Min Typ Max Unit Notes Output Z0 = 50 Ω LVDD/2 RL = 50 Ω RX_CLK RXD[7:0] tGRDXKH tGRX tGRXH tGRXR tGRXF tGRDVKH RX_DV RX_ER |
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