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PPC5632MF0MMGA4 数据表(PDF) 61 Page - Freescale Semiconductor, Inc |
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PPC5632MF0MMGA4 数据表(HTML) 61 Page - Freescale Semiconductor, Inc |
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61 / 118 page  Electrical characteristics MPC5634M Microcontroller Data Sheet, Rev. 4 Preliminary—Subject to Change Without Notice Freescale Semiconductor 61 3.3.1 General notes for specifications at maximum junction temperature An estimation of the chip junction temperature, TJ, can be obtained from the equation: TJ = TA + (RθJA * PD) Eqn. 1 where: TA = ambient temperature for the package (oC) RθJA = junction-to-ambient thermal resistance (oC/W) PD = power dissipation in the package (W) The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide consistent values for estimations and comparisons. The difference between the values determined for the single-layer (1s) board compared to a four-layer board that has two signal layers, a power and a ground plane (2s2p), demonstrate that the effective thermal resistance is not a constant. The thermal resistance depends on the: • Construction of the application board (number of planes) Table 11. Thermal characteristics for 208-pin MAPBGA1 1 Thermal characteristics are targets based on simulation that are subject to change per device characterization. Symbol C Parameter Conditions Value Unit RθJA CC D Junction-to-ambient, natural convection2,3 2 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 3 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal. One layer board - 1s 39 °C/W RθJMA CC D Junction-to-ambient natural convection2,4 4 Per JEDEC JESD51-6 with the board horizontal. Four layer board - 2s2p 24 °C/W RθJA CC D Junction-to-ambient2,4 Single layer board 31 °C/W RθJMA CC D Junction-to-ambient2,4 Four layer board 2s2p 20 °C/W RθJB CC D Junction-to-board5 5 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. Four layer board - 2s2p 13 °C/W RθJC CC D Junction-to-case6 6 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. 6 °C/W Ψ JT CC D Junction-to-package top natural convection7 7 Thermal characterization parameter indicating the temperature difference between package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT. 2 °C/W |
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