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MCP6271-E/ST 数据表(PDF) 20 Page - Microchip Technology |
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MCP6271-E/ST 数据表(HTML) 20 Page - Microchip Technology |
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20 / 36 page ![]() MCP6271/1R/2/3/4/5 DS21810F-page 20 © 2008 Microchip Technology Inc. 6.0 PACKAGING INFORMATION 6.1 Package Marking Information XXXXXXXX XXXXXNNN YYWW 8-Lead PDIP (300 mil) Example: 8-Lead SOIC (150 mil) Example: XXXXXXXX XXXXYYWW NNN 8-Lead MSOP Example: XXXXXX YWWNNN 6271E 644256 5-Lead SOT-23 (MCP6271 and MCP6271R) Example: XXNN CG25 Device Code MCP6271 CGNN MCP6271R ETNN Note: Applies to 5-Lead SOT-23 6-Lead SOT-23 (MCP6273) Example: XXNN CK25 MCP6271 E/P^^256 0644 MCP6271 E/P256 0437 OR MCP6271 E/SN0437 256 MCP6271E SN^^0644 256 OR Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 3 e 3 e |
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