TC1301A/B

DS21798C-page 4

© 2008 Microchip Technology Inc.

Shutdown Supply Current

TC1301A

—58

90

µA

Shutdown Supply Current

TC1301B

—

0.1

1

µA

SHDN1 = SHDN2 = GND

Power Supply Rejection Ratio

PSRR

—

58

—

dB

f

≤ 100 Hz, I

Output Noise

eN

—

830

—

f

≤ 1 kHz, I

Output Short-Circuit Current (Average)

—200

—

mA

—140

—

mA

SHDN Input High Threshold

45

——

SHDN Input Low Threshold

——

15

Wake-Up Time (From SHDN

—5.3

20

µs

See Figure 5-1

Settling Time (From SHDN mode),

—50

—

µs

See Figure 5-2

Thermal Shutdown Die

Temperature

—150

—

°C

Thermal Shutdown Hysteresis

—10

—

°C

Voltage Range

1.0

1.2

—

6.0

6.0

V

RESET Threshold

-1.4

—

+1.4

%

-2.8

—

+2.8

RESET Threshold Tempco

ΔV

30

—

ppm/°C

—180

—

µs

See Figure 5-3

RESET Active Time-out Period

140

300

560

ms

RESET Output Voltage Low

——

0.2

V

See Figure 5-3

RESET Output Voltage High

0.9

——

V

See Figure 5-3

DC CHARACTERISTICS (CONTINUED)

Boldface type specifications apply for junction temperatures of -40°C to +125°C.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Note

1:

2:

3:

4:

Regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is tested

over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating

effects are covered by the thermal regulation specification.

5:

Thermal regulation is defined as the change in output voltage at a time t after a change in power dissipation is applied,

t = 10 ms.

6:

Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its value

measured at a 1V differential.

7:

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

dissipation causes the device to initiate thermal shutdown

.