PCF2127ATSLASH1 datasheet(68/80 Pages) NXP

68 / 80 page

PCF2127A_2

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Product data sheet

Rev. 02 — 7 May 2010

68 of 80

NXP Semiconductors

PCF2127A

Integrated RTC, TCXO and quartz crystal

12.2 Frequency characteristics

[1]

±1 ppm corresponds to a time deviation of ±0.0864 seconds per day.

[2]

Not production tested. Effects of reflow solder not included (see Ref. 3 “AN10857”).

Table 62.

Frequency characteristics

VDD = 1.8 V to 4.2 V; VSS =0V; Tamb =+25 °C, unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

output frequency

on pin CLKOUT;

VDD or VBAT = 3.3 V;

COF[2:0] = 000;

AO[3:0] = 1000

32.768

kHz

Δf/f

frequency stability

VDD or VBAT = 3.3 V

Tamb = −15 °C to +60 °C

[1] -

±3

±5ppm

Tamb = −25 °Cto −15 °C

and

Tamb =+60 °Cto+65 °C

[1] -

±5

±10

ppm

Δf

xtal/fxtal

relative crystal frequency variation

crystal aging, first year;

VDD or VBAT = 3.3 V

[2] --

±3ppm

Δf/ΔV

frequency variation with voltage

on pin CLKOUT

±1-

ppm/V

(1) Temperature compensated frequency.

(2) Uncompensated typical tuning-fork crystal frequency.

Fig 50. Characteristic of frequency with respect to temperature

Temperature (

°C)

−40

100

080

−20

001aaj650

−40

Frequency

stability

(ppm)

−80

± 10 ppm

± 5 ppm

± 10 ppm

(1)

(2)

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