SC102205 datasheet(99/140 Pages) FREESCALE

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Device User Guide — 9S12DT128DGV2/D V02.17

101

Freescale Semiconductor

calculations refer to Section A.1.8 Power Dissipation and Thermal

Characteristics.

A.1.8 Power Dissipation and Thermal Characteristics

Power dissipation and thermal characteristics are closely related. The user must assure that the maximum

operating junction temperature is not exceeded. The average chip-junction temperature (TJ)in °C can be

obtained from:

Table A-4 Operating Conditions

Rating

Symbol

Min

Typ

Max

Unit

I/O, Regulator and Analog Supply Voltage

VDD5

4.5

5.25

Digital Logic Supply Voltage 1

NOTES:

1. The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The

given operating range applies when this regulator is disabled and the device is powered from an external source.

VDD

2.35

2.5

2.75

PLL Supply Voltage 1

VDDPLL

2.25

2.5

2.75

Voltage Difference VDDX to VDDR and VDDA

∆

VDDX

-0.1

0.1

Voltage Difference VSSX to VSSR and VSSA

∆

VSSX

-0.1

0.1

Bus Frequency

fbus

0.252

2. Some blocks e.g. ATD (conversion) and NVMs (program/erase) require higher bus frequencies for proper oper-

ation.

MHz

MC9S12DT128C

Operating Junction Temperature Range

-40

100

°C

Operating Ambient Temperature Range 3

3. Please refer to Section A.1.8 Power Dissipation and Thermal Characteristics for more details about the rela-

tion between ambient temperature TA and device junction temperature TJ.

-40

°C

MC9S12DT128V

Operating Junction Temperature Range

-40

120

°C

Operating Ambient Temperature Range 3

-40

105

°C

MC9S12DT128M

Operating Junction Temperature Range

-40

140

°C

Operating Ambient Temperature Range 3

-40

125

°C

•

()

Junction Temperature, [

°C ]

Ambient Temperature, [

°C ]

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