PCF8564ACX9SLASHBSLASH1 datasheet(2/44 Pages) NXP

2 / 44 page

PCF8564A_1

Product data sheet

Rev. 1 — 8 October 2009

2 of 44

NXP Semiconductors

PCF8564A

Real time clock and calendar

Ordering information

[1]

Not to be used for new designs.

Marking

Table 1.

Ordering information

Type number

Package

Name

Description

Delivery form

Version

Die type 1[1]

PCF8564AU/5BD/1

PCF8564AU

wire bond die; 9 bonding pads

unsawn wafer;

thickness 280

µm

PCF8564AU

PCF8564AU/5GE/1

PCF8564AU

wire bond die; 9 bonding pads

unsawn wafer;

thickness 687

µm

PCF8564AU

PCF8564AU/10AA/1

PCF8564AU

wire bond die; 9 bonding pads

wafer sawn on FFC;

thickness 200

µm

PCF8564AU

Die type 2

PCF8564AU/5BB/1

PCF8564AU

wire bond die; 9 bonding pads

unsawn wafer;

thickness 280

µm

PCF8564AU

PCF8564AU/5GB/1

PCF8564AU

wire bond die; 9 bonding pads

unsawn wafer;

thickness 687

µm

PCF8564AU

PCF8564AU/10AB/1

PCF8564AU

wire bond die; 9 bonding pads

wafer sawn on FFC;

thickness 200

µm

PCF8564AU

Die type 3

PCF8564ACX9/1

PCF8564ACX9

wafer level chip-size package;

9 bumps; 1.27

× 1.9 × 0.29 mm

wafer sawn on FFC;

thickness 200

µm;

die with solder bumps

PCF8564ACX9

PCF8564ACX9/B/1

PCF8564ACX9

wafer level chip-size package;

9 bumps; 1.27

× 1.9 × 0.29 mm

tape and reel;

thickness 200

µm;

die with solder bumps

PCF8564ACX9

Table 2.

Marking codes

Type number

Marking code

Die type 1

PCF8564AU/5BD/1

PC8564A-1

PCF8564AU/5GE/1

PC8564A-1

PCF8564AU/10AA/1

PC8564A-1

Die type 2

PCF8564AU/5BB/1

PC8564A-1

PCF8564AU/5GB/1

PC8564A-1

PCF8564AU/10AB/1

PC8564A-1

Die type 3

PCF8564ACX9/1

PC8564A-1

PCF8564ACX9/B/1

PC8564A-1

PCF8564ACX9/B/1 数据表(PDF) 2 Page - NXP Semiconductors

PCF8564ACX9/B/1 数据表(HTML) 2 Page - NXP Semiconductors

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PCF8564ACX9/B/1 数据表(PDF) 2 Page - NXP Semiconductors

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