PCF8564ACX9SLASHBSLASH1 datasheet(33/44 Pages) NXP

33 / 44 page

PCF8564A_1

Product data sheet

Rev. 1 — 8 October 2009

33 of 44

NXP Semiconductors

PCF8564A

Real time clock and calendar

Fig 28. Bare die outline of PCF8564ACX9

References

Outline

version

European

projection

Issue date

IEC

JEDEC

JEITA

PCF8564ACX9

pcf8564acx9_po

09-08-25

09-09-09

Unit

max

nom

min

0.29

0.09

0.2

1.27

1.9

0.73

0.27

Dimensions

Note

1. Chip dimensions including sawline.

2. Marking code: PC8564A-1

WLCSP9: wafer level chip-size package; 9 bumps; 1.27 x 1.9 x 0.29 mm

PCF8564ACX9

0.2

bD(1)

E(1)

ee1

0.45

0.5

1 mm

scale

(2)

detail X

0,0

Table 32.

Solder bump description for all PCF8564ACX types

All x/y coordinates represent the position of the center of each bump with respect to the center

(x/y = 0) of the chip; see Figure 28.

Symbol

Bump

X (

µm)

Y (

µm)

Description

OSCI

−368

738

oscillator input

OSCO

−368

188

oscillator output

INT

−368

−262

open-drain interrupt output (active LOW)

VSS

−368

−712

ground (substrate)

SDA

362

−712

serial data I/O

SCL

362

−262

serial clock input

CLKOUT

362

188

CMOS push-pull clock output

VDD

456

supply

CLKOE

362

738

CLKOUT output enable

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