| 数据搜索系统,热门电子元器件搜索 |
|
PCF8564ACX9/B/1 数据表(PDF) 35 Page - NXP Semiconductors |
|
|
|||||||||||||||||||||||||||||
PCF8564ACX9/B/1 数据表(HTML) 35 Page - NXP Semiconductors |
|
35 / 44 page ![]() PCF8564A_1 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 1 — 8 October 2009 35 of 44 NXP Semiconductors PCF8564A Real time clock and calendar 18. Packing information 18.1 Wafer and FFC information Wafer thickness, see Table 1. Fig 30. Wafer layout of PCF8564AU X Saw lane detail X Marking code Straight edge of the wafer 013aaa037 Pin 1 18 µm die type 1 = 84 µm die type 2 = 74 µm die type 1 = 84 µm die type 2 = 74 µm Seal ring plus gap to active circuit ~18 µm 18 µm |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |