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ADM1023ARQZ-R7 数据表(PDF) 14 Page - ON Semiconductor |
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ADM1023ARQZ-R7 数据表(HTML) 14 Page - ON Semiconductor |
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14 / 16 page ![]() ADM1023 http://onsemi.com 14 4. If more than one device’s ALERT output is low, the one with the lowest device address has priority, in accordance with normal SMBus arbitration. 5. Once the ADM1023 has responded to the ARA, it resets its ALERT output, provided that the error condition that caused the ALERT no longer exists. If the SMBALERT line remains low, the master sends ARA again, and so on until all devices whose ALERT outputs were low have responded. Low Power Standby Modes The ADM1023 can be put into a low power standby mode using hardware or software, that is, by taking the STBY input low or by setting Bit 6 of the configuration register. When STBY is high or Bit 6 is low, the ADM1023 operates normally. When STBY is pulled low or Bit 6 is high, the ADC is inhibited, and any conversion in progress is terminated without writing the result to the corresponding value register. The SMBus is still enabled. Power consumption in the standby mode is reduced to less than 10 mA if there is no SMBus activity, or 100 mA if there are clock and data signals on the bus. These two modes are similar but not identical. When STBY is low, conversions are completely inhibited. When Bit 6 is set, but STBY is high, a one−shot conversion of both channels can be initiated by writing any data value to the one−shot register (Address 0x0F). Sensor Fault Detection The ADM1023 has a fault detector at the D+ input that detects if the external sensor diode is open−circuit. This is a simple voltage comparator that trips if the voltage at D+ exceeds VCC – 1.0 V (typical). The output of this comparator is checked when a conversion is initiated and sets Bit 2 of the status register if a fault is detected. If the remote sensor voltage falls below the normal measuring range, for example, due to the diode being short−circuited, the ADC outputs –128 °C (1000 0000 000). Because the normal operating temperature range of the device extends only down to 0 °C, this output code is never seen in normal operation and can be interpreted as a fault condition. In this respect, the ADM1023 differs from, and improves upon, competitive devices that output 0 if the external sensor goes short−circuit. Unlike the ADM1023, these other devices can misinterpret a genuine 0 °C measurement as a fault condition. If the external diode channel is not being used and is shorted out, the resulting ALERT may be cleared by writing 0x80 (−128 °C) to the low limit register. Applications Factors Affecting Accuracy, Remote Sensing Diode The ADM1023 is designed to work with substrate transistors built into processors or with discrete transistors. Substrate transistors are generally PNP types with the collector connected to the substrate. Discrete types can be either PNP or NPN, connected as a diode (base−shorted to collector). If an NPN transistor is used, the collector and base are connected to D+ and the emitter to D−. If a PNP transistor is used, the collector and base are connected to D− and the emitter to D+. The user has no choice with substrate transistors, but if a discrete transistor is used, the best accuracy is achieved by choosing devices according to the following criteria: • Base emitter voltage greater than 0.25 V at 6 mA, at the highest operating temperature. • Base emitter voltage less than 0.95 V at 100 mA, at the lowest operating temperature. • Base resistance less than 100 W. • Small variation in hfe (approximately 50 to 150), which indicates tight control of VBE characteristics. Transistors such as 2N3904, 2N3906, or equivalents in SOT−23 packages are suitable devices to use. Thermal Inertia and Self−Heating Accuracy depends on the temperature of the remote sensing diode and/or the internal temperature sensor being at the same temperature as that being measured, and a number of factors can affect this. Ideally, the sensor should be in good thermal contact with the part of the system being measured, such as the processor, for example. If it is not in good thermal contact, the thermal inertia caused by the mass of the sensor causes a lag in the response of the sensor to a temperature change. With the remote sensor, this should not be a problem, as it will be either a substrate transistor in the processor or a small package device, such as SOT−23, placed in close proximity to it. The on−chip sensor, however, is often remote from the processor and monitors only the general ambient temperature around the package. The thermal time constant of the QSOP−16 package is about 10 seconds. In practice, the package has electrical, and hence thermal, connection to the printed circuit board. Therefore, the temperature rise due to self−heating is negligible. Layout Considerations Digital boards can be electrically noisy environments, and the ADM1023 is measuring very small voltages from the remote sensor; therefore, care must be taken to minimize noise induced at the sensor inputs. The following precautions are needed: • Place the ADM1023 as close as possible to the remote sensing diode. Provided that the worst noise sources, such as clock generators, data/address buses, and CRTs, are avoided, this distance can be 4 to 8 inches. • Route the D+ and D− tracks close together, in parallel, with grounded guard tracks on each side. Provide a ground plane under the tracks if possible (see Figure 19). |
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