ADM1023

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2

Figure 1. Functional Block Diagram

ON−CHIP

TEMPERATURE

SENSOR

A−TO−D

CONVERTER

BUSY

RUN/STANDBY

EXTERNAL DIODE OPEN−CIRCUIT

ADDRESS POINTER

REGISTER

ONE−SHOT

REGISTER

CONVERSION RATE

REGISTER

OFFSET

REGISTERS

REMOTE TEMPERATURE

HIGH−LIMIT REGISTERS

CONFIGURATION

REGISTER

INTERRUPT

MASKING

SMBus INTERFACE

LOCAL TEMPERATURE

LOW−LIMIT COMPARATOR

LOCAL TEMPERATURE

HIGH−LIMIT COMPARATOR

REMOTE TEMPERATURE

LOW−LIMIT COMPARATOR

REMOTE TEMPERATURE

HIGH−LIMIT COMPARATOR

REMOTE TEMPERATURE

VALUE REGISTERS

LOCAL TEMPERATURE

VALUE REGISTER

STATUS REGISTER

NC

GND

NC

GND

NC

NC

NC

SDATA

SCLK

ADD0

ADD1

ALERT

STBY

D+

D–

REMOTE TEMPERATURE

LOW−LIMIT REGISTERS

LOCAL TEMPERATURE

HIGH−LIMIT REGISTER

LOCAL TEMPERATURE

LOW−LIMIT REGISTER

ANALOG

MUX

NC = NO CONNECT

ADM1023

3

4

1

2

5

7

8

9

13

16

12

14

10

6

11

15

ABSOLUTE MAXIMUM RATINGS

Parameter

Rating

Unit

−0.3 to +6.0

V

D+, ADD0, ADD1

V

D− to GND

−0.3 to +0.6

SCLK, SDATA, ALERT, STBY

−0.3 to +6.0

V

Input Current

±50

mA

Input Current, D−

±10

mA

ESD Rating, All Pins (Human Body Model)

2000

V

Continuous Power Dissipation

Up to 70

°C

Derating Above 70

°C

650

6.7

mW

mW/

°C

Operating Temperature Range

−55 to +125

°C

150

°C

Storage Temperature Range

−65 to +150

°C

Lead Temperature, Soldering (10 s)

300

°C

IR Reflow Peak Temperature

220

°C

IR Reflow Peak Temperature for Pb−Free

260

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

NOTE:

This device is ESD sensitive. Use standard ESD precautions when handling.

THERMAL CHARACTERISTICS

Parameter

Rating

16−Lead QSOP Package