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STE100P

9

PACKAGE INFORMATION

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These

packages have a Lead-free second level interconnect. The category of second Level Interconnect is

marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97.

The maximum ratings related to soldering conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

Figure 17. TQFP64 (10x10x1.4mm) Mechanical Data & Package Dimensions

OUTLINE AND

MECHANICAL DATA

A

A2

A1

C

16

17

32

33

48

49

64

D3

D1

D

e

1

K

TQFP64

Seating Plane

0.08mm

DIM.

mm

inch

MIN.

TYP.

MAX.

MIN.

TYP.

MAX.

A

1.60

0.063

A1

0.05

0.15

0.002

0.006

A2

1.35

1.40

1.45

0.053

0.055

0.057

B

0.17

0.22

0.27

0.0066 0.0086 0.0106

C

0.09

0.0035

D

11.80

12.00

12.20

0.464

0.472

0.480

D1

9.80

10.00

10.20

0.386

0.394

0.401

D3

7.50

0.295

e

0.50

0.0197

E

11.80

12.00

12.20

0.464

0.472

0.480

E1

9.80

10.00

10.20

0.386

0.394

0.401

E3

7.50

0.295

L

0.45

0.60

0.75

0.0177 0.0236 0.0295

L1

1.00

0.0393

K

0˚ (min.), 3.5˚ (min.), 7˚(max.)

ccc

0.080

0.0031

TQFP64 (10 x 10 x 1.4mm)

0051434 E

ccc