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M24C02-R 数据表(PDF) 30 Page - STMicroelectronics |
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M24C02-R 数据表(HTML) 30 Page - STMicroelectronics |
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30 / 39 page ![]() Package mechanical data M24C16, M24C08, M24C04, M24C02, M24C01 30/39 Doc ID 5067 Rev 16 Figure 16. TSSOP8 – 8 lead thin shrink small outline, package outline 1. Drawing is not to scale. 2. The circle in the top view of the package indicates the position of pin 1. Table 22. TSSOP8 – 8 lead thin shrink small outline, package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Typ. Min. Max. Typ. Min. Max. A 1.200 0.0472 A1 0.050 0.150 0.0020 0.0059 A2 1.000 0.800 1.050 0.0394 0.0315 0.0413 b 0.190 0.300 0.0075 0.0118 c 0.090 0.200 0.0035 0.0079 CP 0.100 0.0039 D 3.000 2.900 3.100 0.1181 0.1142 0.1220 e 0.650 – – 0.0256 – – E 6.400 6.200 6.600 0.2520 0.2441 0.2598 E1 4.400 4.300 4.500 0.1732 0.1693 0.1772 L 0.600 0.450 0.750 0.0236 0.0177 0.0295 L1 1.000 0.0394 α 0° 8° 0° 8° TSSOP8AM 1 8 CP c L E E1 D A2 A α e b 4 5 A1 L1 |
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