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CDCE925PWR 数据表(PDF) 16 Page - Texas Instruments

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部件名 CDCE925PWR
功能描述  PROGRAMMABLE 2-PLL VCXO CLOCK SYNTHESIZER WITH 1.8-V, 2.5-V and 3.3-V LVCMOS OUTPUTS
PDF  27 Pages
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制造商  TI [Texas Instruments]
网页  http://www.ti.com
标志 TI - Texas Instruments

CDCE925PWR 数据表(HTML) 16 Page - Texas Instruments

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Xin
Xout
Vctr
VCXO
XO
20pF
20pF
i.e.
XCSEL =10pF
CDCE925
CDCEL925
SCAS847F – JULY 2007 – REVISED MARCH 2010
www.ti.com
Table 9. Generic Configuration Register
Offset
(1)
Bit
(2)
Acronym
Default
(3)
Description
7
E_EL
Xb
Device identification (read-only): 1 is CDCE925 (3.3 V out), 0 is CDCEL925 (1.8 V out)
00h
6:4
RID
Xb
Revision Identification Number (read only)
3:0
VID
1h
Vendor Identification Number (read only)
01h
7
0b
Reserved – always write 0
EEPROM Programming Status4:
(4) (read only)
0 – EEPROM programming is completed
6
EEPIP
0b
1 – EEPROM is in programming mode
Permanently Lock EEPROM Data
(5)
0 – EEPROM is not locked
5
EELOCK
0b
1 – EEPROM will be permanently locked
Device Power Down (overwrites S0/S1/S2 setting; configuration register settings are unchanged)
Note: PWDN cannot be set to 1 in the EEPROM.
4
PWDN
0b
0 – device active (all PLLs and all outputs are enabled)
1 – device power down (all PLLs in power down and all outputs in 3-state)
3:2
INCLK
00b
Input clock selection:
00 – Xtal
01 – VCXO
10 – LVCMOS
11 – reserved
1:0
SLAVE_ADR
00b
Address Bits A0 and A1 of the Slave Receiver Address
7
M1
1b
Clock source selection for output Y1:
0 – input clock
1 – PLL1 clock
Operation mode selection for pin 14/15
(6)
6
SPICON
0b
0 – serial programming interface SDA (pin 15) and SCL (pin 14)
1 – control pins S1 (pin 15) and S2 (pin 14)
02h
5:4
Y1_ST1
11b
Y1-State0/1 Definition
00 – device power down (all PLLs in power down and all
10 – Y1 disabled to low
3:2
Y1_ST0
01b
outputs in 3-State)
11 – Y1 enabled
01 – Y1 disabled to 3-state
1:0
Pdiv1 [9:8]
10-Bit Y1-Output-Divider Pdiv1:
0 – divider reset and stand-by
001h
1-to-1023 – divider value
03h
7:0
Pdiv1 [7:0]
04h
7
Y1_7
0b
Y1_ST0/Y1_ST1 State Selection
(7)
6
Y1_6
0b
0 – State0 (predefined by Y1_ST0)
1 – State1 (predefined by Y1_ST1)
5
Y1_6
0b
4
Y1_6
0b
3
Y1_6
0b
2
Y1_6
0b
1
Y1_6
0b
0
Y1_6
0b
05h
Crystal Load Capacitor Selection
(8)
00h
→ 0 pF
01h
→ 1 pF
02h
→ 2 pF
7:3
XCSEL
0Ah
:
14h-to-1Fh
→ 20 pF
2:0
0b
Reserved – do not write other than 0
06h
7-Bit Byte Count (defines the number of bytes which will be sent from this device at the next Block Read transfer); all bytes
7:1
BCOUNT
30h
have to be read out to correctly finish the read cycle.)
0– no EEPROM write cycle
0
EEWRITE
0b
Initiate EEPROM Write Cycle
(9)
1 – start EEPROM write cycle (internal register are saved to the EEPROM)
(1)
Writing data beyond ‘30h’ may affect device function.
(2)
All data transferred with the MSB first.
(3)
Unless customer-specific setting.
(4)
During EEPROM programming, no data is allowed to be sent to the device via the SDA/SCL bus until the programming sequence is
completed. Data, however, can be read out during the programming sequence (Byte Read or Block Read).
(5)
If this bit is set to high in the EEPROM, the actual data in the EEPROM is permanently locked. No further programming is possible.
Data, however can still be written via SDA/SCL bus to the internal register to change device function on the fly. But new data can no
longer be saved to the EEPROM. EELOCK is effective only, if written into the EEPROM.
(6)
Selection of “control pins” is effective only if written into the EEPROM. Once written into the EEPROM, the serial programming pins are
no longer available. However, if VDDOUT is forced to GND, the two control pins, S1 and S2, temporally act as serial programming pins
(SDA/SCL), and the two slave receiver address bits are reset to A0=”0” and A1=“0”.
(7)
These are the bits of the Control Terminal Register. The user can predefine up to eight different control settings. These settings then
can be selected by the external control pins, S0, S1, and S2.
(8)
The internal load capacitor (C1, C2) has to be used to achieve the best clock performance. External capacitors should be used only to
finely adjust CL by a few picofarads. The value of CL can be programmed with a resolution of 1 pF for a crystal load range of 0 pF to 20
pF. For CL > 20 pF, use additional external capacitors. Also, the value of the device input capacitance has to be considered which
always adds 1.5 pF (6 pF//2 pF) to the selected CL. For more information about VCXO configuration and crystal recommendation, see
application report SCAA085.
(9)
Note: The EEPROM WRITE bit must be sent last. This ensures that the content of all internal registers are stored in the EEPROM. The
EEWRITE cycle is initiated with the rising edge of the EEWRITE bit. A static level high does not trigger an EEPROM WRITE cycle. The
EEWRITE bit has to be reset to low after the programming is completed. The programming status can be monitored by reading out
EEPIP. If EELOCK is set to high, no EEPROM programming is possible.
16
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Copyright © 2007–2010, Texas Instruments Incorporated
Product Folder Link(s): CDCE925 CDCEL925



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