M95010-R datasheet(42/43 Pages) STMICROELECTRONICS

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Revision history

M95040, M95020, M95010

42/43

Doc ID 6512 Rev 8

06-Nov-2006

Document converted to new template, Table 5: Status register format

moved to below Section 6.3: Read Status Register (RDSR).

PDIP package removed. UFDFPN8 (MB) package added (see Figure 20

and Table 23) and SO8N package specifications updated (see Figure 18

and Table 21). Packages are ECOPACK® compliant.

Section 6.7: Cycling added. Section 2.8: Supply voltage (VCC) added and

information removed below Section 4: Operating features.

Figure 3: Bus master and memory devices on the SPI bus modified.

TLEAD parameter modified, Note 1 changed, and TA added to Table 7:

Absolute maximum ratings.

Characteristics of previous product identified by process letter K removed.

CL modified in Table 11: AC test measurement conditions. Note removed

below Table 13 and Table 13.

Information in Table 16 is no longer Preliminary data, ICC, ICC1 and VIL

modified. End timing line of tSHQZ moved in Figure 17.

tCHHL and tCHHH changed to tCLHL and tCLHH, respectively in Figure 16,

Table 18, Table 17, Table 18, Table 19 and Table 20.

Plating technology and Process updated in Table 24: Ordering information

scheme.

20-Mar-2008

Section 2.8: Supply voltage (VCC) updated.

Section 3: Connecting to the SPI bus modified.

Section 6.6: Write to Memory Array (WRITE) modified.

Device grade 6 removed in the 4.5 to 5.5 V VCC range (seeTable 8).

Table 16: DC characteristics (M950x0-R, device grade 6) modified.

Table 18: AC characteristics (M950x0-W, device grade 6) modified:

frequency changed from 5 MHz to 10 MHz.

Table 20: AC characteristics (M950x0-R, device grade 6) modified:

frequency changed from 2 MHz to 5 MHz.

Section 10: Package mechanical data:

– Inches are calculated from millimeters and rounded to the third decimal

digit.

– UFDFPN8 package specifications modified.

Blank option removed below Plating technology in Table 24: Ordering

information scheme. Table 25, Table 26 and Table 27 added.

24-Sep-2009

Section 2.8: Supply voltage (VCC) and Section 6.4: Write Status Register

(WRSR) updated.

Section 6.6: Write to Memory Array (WRITE) clarified.

IOL and IOH added to Table 7: Absolute maximum ratings.

VRES added to DC characteristics tables 13, 14, 15 and 16. tCLQV

modified in Figure 20: AC characteristics (M950x0-R, device grade 6).

Note added to Table 20: AC characteristics (M950x0-R, device grade 6).

Figure 15: Serial input timing, Figure 16: Hold timing and Figure 17: Serial

output timing updated.

Note added below Figure 20: UFDFPN8 (MLP8) — 8-lead ultra thin fine

pitch dual flat package no lead 2 × 3mm, package outline.

/W process option removed from Table 24: Ordering information scheme.

ECOPACK text updated. Small text changes.

Table 28.

Document revision history (continued)

Date

Version

Changes

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