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5000 数据表(PDF) 75 Page - Intel Corporation

部件名 5000
功能描述  Dual-Core Intel Xeon Processor
PDF  104 Pages
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制造商  INTEL [Intel Corporation]
网页  http://www.intel.com
标志 INTEL - Intel Corporation

5000 数据表(HTML) 75 Page - Intel Corporation

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Dual-Core Intel® Xeon® Processor 5000 Series Datasheet
75
Thermal Specifications
Notes:
1.
Thermal Profile is representative of a volumetrically constrained platform. Please refer to Table 6-8 for
discrete points that constitute the thermal profile.
2.
Implementation of Thermal Profile should result in virtually no TCC activation. Furthermore, utilization of
thermal solutions that do not meet Thermal Profile will not meet the processor’s thermal specifications and
may result in permanent damage to the processor.
3.
Refer to the Dual-Core Intel® Xeon® Processor 5000 Series Thermal/Mechanical Design Guidelines for
system and environment implementation details.
6.1.2
Thermal Metrology
The minimum and maximum case temperatures (TCASE) specified in Table 6-2,
Table 6-3, Table 6-5, and Table 6-6 are measured at the geometric top center of the
processor integrated heat spreader (IHS). Figure 6-4 illustrates the location where
Figure 6-3. Dual-Core Intel Xeon Processor 5063 (MV) Thermal Profile
Thermal Profile
40
45
50
55
60
65
70
0
10
2030
40
5060
70
80
90
100
Pow e r [W]
Thermal Profile
Y = 0.260*x + 42.3
TCASE_MAX@TDP
Thermal Profile
40
45
50
55
60
65
70
0
10
2030
40
5060
70
80
90
100
Pow e r [W]
Thermal Profile
Y = 0.260*x + 42.3
TCASE_MAX@TDP
Table 6-8.
Dual-Core Intel Xeon Processor 5063 (MV) Thermal Profile Table
Power (W)
TCASE_MAX (° C)
Power (W)
TCASE_MAX (° C)
P_profile_min_B=29.6
50.0
75
61.8
35
51.4
80
63.1
40
52.7
85
64.4
45
54.0
90
65.7
50
55.3
95
67.0
55
56.6
60
57.9
65
59.2
70
60.5



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