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Dual-Core Intel® Xeon® Processor 5000 Series Datasheet

Boxed Processor Specifications

8.1

Introduction

Intel boxed processors are intended for system integrators who build systems from

components available through distribution channels. The Dual-Core Intel® Xeon®

Processor 5000 series will be offered as an Intel boxed processor.

Intel will offer the Dual-Core Intel Xeon Processor 5000 series boxed processor with

two heat sink configurations available for each processor frequency: 1U passive/2U

active combination solution and a 2U passive only solution. The 1U passive/2U active

combination solution is based on a 1U passive heat sink with a removable fan that will

be pre-attached at shipping. This heat sink solution is intended to be used as either a

1U passive heat sink or a 2U+ active heat sink. Although the active combination

solution with removable fan mechanically fits into a 2U keepout, additional design

considerations may need to be addressed to provide sufficient airflow to the fan inlet.

The 1U passive/2U active combination solution in the active fan configuration is

primarily designed to be used in a pedestal chassis where sufficient air inlet space is

present and strong side directional airflow is not an issue. The 1U passive/active

combination solution with the fan removed and the 2U passive thermal solution require

the use of chassis ducting and are targeted for use in rack mount servers. The

retention solution used for these products is called the Common Enabling Kit, or CEK.

The CEK base is compatible with both thermal solutions and uses the same hole

locations as the Intel® Xeon® processor with 800 MHz FSB.

The 1U passive/active combination solution will utilize a removable fan with a 4-pin

pulse width modulated (PWM) T-diode control. Use of a 4-pin PWM T-diode controlled

active thermal solution helps customers meet acoustic targets in pedestal platforms

through the motherboards’s ability to directly control the RPM of the processor heat

sink fan. Please see Section 8.3 for more details. Figure 8-1 through Figure 8-3 are

representations of the two heat sink solutions.

Figure 8-1. Boxed Dual-Core Intel Xeon Processor 5000 Series 1U Passive/2U Active

Combination Heat Sink (With Removable Fan)

5000 数据表(PDF) 89 Page - Intel Corporation