5000 datasheet(104/104 Pages) INTEL

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Debug Tools Specifications

104

Dual-Core Intel® Xeon® Processor 5000 Series Datasheet

9.3.1

Mechanical Considerations

The LAI is installed between the processor socket and the processor. The LAI plugs into

the socket, while the processor plugs into a socket on the LAI. Cabling that is part of

the LAI egresses the system to allow an electrical connection between the processor

and a logic analyzer. The maximum volume occupied by the LAI, known as the keepout

volume, as well as the cable egress restrictions, should be obtained from the logic

analyzer vendor. System designers must make sure that the keepout volume remains

unobstructed inside the system. Note that it is possible that the keepout volume

reserved for the LAI may include differerent requirements from the space normally

occupied by the heatsink. If this is the case, the logic analyzer vendor will provide a

cooling solution as part of the LAI.

9.3.2

Electrical Considerations

The LAI will also affect the electrical performance of the FSB, therefore it is critical to

obtain electrical load models from each of the logic analyzer vendors to be able to run

system level simulations to prove that their tool will work in the system. Contact the

logic analyzer vendor for electrical specifications and load models for the LAI solution

they provide.

5000 数据表(PDF) 104 Page - Intel Corporation