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M95512-R 数据表(PDF) 40 Page - STMicroelectronics |
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M95512-R 数据表(HTML) 40 Page - STMicroelectronics |
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40 / 48 page ![]() Package mechanical data M95512-W, M95512-R 40/48 Doc ID 11124 Rev 13 Figure 24. TSSOP8 – 8 lead thin shrink small outline, package outline 1. Drawing is not to scale. 2. The central pad (area E2 by D2 in the above illustration) is internally pulled to VSS. It must not be connected to any other voltage or signal line on the PCB, for example during the soldering process. Table 20. TSSOP8 – 8 lead thin shrink small outline, package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Typ Min Max Typ Min Max A 1.200 0.0472 A1 0.050 0.150 0.0020 0.0059 A2 1.000 0.800 1.050 0.0394 0.0315 0.0413 b 0.190 0.300 0.0075 0.0118 c 0.090 0.200 0.0035 0.0079 CP 0.100 0.0039 D 3.000 2.900 3.100 0.1181 0.1142 0.1220 e 0.650 – – 0.0256 – – E 6.400 6.200 6.600 0.2520 0.2441 0.2598 E1 4.400 4.300 4.500 0.1732 0.1693 0.1772 L 0.600 0.450 0.750 0.0236 0.0177 0.0295 L1 1.000 0.0394 0° 8° 0° 8° N8 8 TSSOP8AM 1 8 CP c L E E1 D A2 A α e b 4 5 A1 L1 |
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