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M95512-R 数据表(PDF) 42 Page - STMicroelectronics |
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M95512-R 数据表(HTML) 42 Page - STMicroelectronics |
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42 / 48 page ![]() Package mechanical data M95512-W, M95512-R 42/48 Doc ID 11124 Rev 13 Figure 26. WLCSP-R – 8-bump wafer-length chip-scale package outline 1. Drawing is not to scale. Table 22. WLCSP-R – 8-bump wafer-length chip-scale package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Typ Min Max Typ Min Max A 0.580 0.490 0.670 0.0228 0.0193 0.0264 A1 0.230 0.0091 A2 0.350 0.0138 b(2) 2. Measured at the maximum bump diameter parallel to primary datum Z. 0.322 0.0127 D 1.433 1.548 0.0564 0.0609 E 1.901 2.016 0.0748 0.0794 e 1.000 0.0394 e1 0.866 0.0341 e2 0.500 0.0197 e3 0.433 0.0170 F 0.284 0.0112 G 0.453 0.0178 N (number of terminals) 8 8 aaa 0.110 0.0043 eee 0.060 0.0024 D E Orientation reference Wafer back side Side view Detail A A2 A A B C D E Orientation reference 1 2 3 e1 e3 e2 e F G Bump side XY aaa Bump Seating plane Z b Detail A rotated by 90 °C A1 eee Z ME_1Cc |
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