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SPP18P06P 数据表(PDF) 2 Page - Infineon Technologies AG |
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SPP18P06P 数据表(HTML) 2 Page - Infineon Technologies AG |
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2 / 9 page ![]() SPP18P06P G Parameter Symbol Conditions Unit min. typ. max. Thermal characteristics Thermal resistance, junction - case R thJC - - 1.85 K/W Thermal resistance, junction - ambient, leaded R thJA -- 62 SMD version, device on PCB: R thJA minimal footprint - - 62 K/W 6 cm 2 cooling area1) -- 40 Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D=-250 µA -60 - - V Gate threshold voltage V GS(th) V DS=V GS, I D=- 1000 µA -2.1 2.7 -4 Zero gate voltage drain current I DSS V DS=-60 V, V GS=0 V, T j=25 °C - -0.1 -1 µA V DS=-60 V, V GS=0 V, T j=150 °C - -10 -100 Gate-source leakage current I GSS V GS=-20 V, V DS=0 V - -10 -100 nA Drain-source on-state resistance R DS(on) V GS=-10 V, I D=-13.2 A - 102 130 m Ω Transconductance g fs |V DS|>2|I D|R DS(on)max, I D=-13.2 A 510 - S 1) Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical without blown air. Values Rev1. 8 page 2 200 9-04-14 |
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