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MPC5674F 数据表(PDF) 21 Page - Freescale Semiconductor, Inc |
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MPC5674F 数据表(HTML) 21 Page - Freescale Semiconductor, Inc |
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21 / 132 page  Electrical Characteristics MPC5674F Microcontroller Data Sheet, Rev. 6 Freescale Semiconductor 21 4.2 Thermal Characteristics 1 Functional operating conditions are given in the DC electrical specifications. Absolute maximum ratings are stress ratings only, and functional operation at the maxima is not guaranteed. Stress beyond the listed maxima may affect device reliability or cause permanent damage to the device. 2 Absolute maximum voltages are currently maximum burn-in voltages. Absolute maximum specifications for device stress have not yet been determined. 3 1.2 V ±10% for proper operation. This parameter is specified at a maximum junction temperature of 150 °C. 4 1.65 V for 10 hours cumulative time, 1.2 V +10% for time remaining. 5 6.4 V for 10 hours cumulative time, 5.0 V +10% for time remaining. 6 Voltage overshoots during a high-to-low or low-to-high transition must not exceed 10 seconds per instance. 7 5.3 V for 10 hours cumulative time, 3.3 V +10% for time remaining. 8 MPC5674F has two analog power supply pins on the pinout: VDDA_A and VDDA_B. 9 MPC5674F has two analog ground supply pins on the pinout: VSSA_A and VSSA_B. 10 MPC5674F has two analog low reference voltage pins on the pinout: VRL_A and VRL_B. 11 MPC5674F has two analog high reference voltage pins on the pinout: VRH_A and VRH_B. 12 Total injection current for all pins must not exceed 25 mA at maximum operating voltage. 13 Injection current of ±5 mA allowed for limited duration for analog (ADC) pads and digital 5 V pads. The maximum accumulated time at this current shall be 60 hours. This includes an assumption of a 5.25 V maximum analog or VDDEH supply when under this stress condition. 14 Total injection current for all analog input pins must not exceed 15 mA. 15 Lifetime operation at these specification limits is not guaranteed. 16 Solder profile per CDF-AEC-Q100. 17 Moisture sensitivity per JEDEC test method A112. Table 4. Thermal Characteristics, 416-pin TEPBGA Package1 1 Thermal characteristics are targets based on simulation that are subject to change per device characterization. This data is PRELIMINARY based on similar package used on other devices. Characteristic Symbol Value Unit Junction to Ambient 2,3 Natural Convection (Single layer board) 2 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 3 Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification. RθJA 24 °C/W Junction to Ambient 2,4 Natural Convection (Four layer board 2s2p) 4 Per JEDEC JESD51-6 with the board horizontal. RθJA 18 °C/W Junction to Ambient (@200 ft./min., Single layer board) RθJMA 19 °C/W Junction to Ambient (@200 ft./min., Four layer board 2s2p) RθJMA 14 °C/W Junction to Board 5 5 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. RθJB 9°C/W Junction to Case 6 RθJC 6°C/W Junction to Package Top 7 Natural Convection Ψ JT 2°C/W |
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