Sheet No.: D1-A00301EN

4

PD100MF0MPx

■ Design Considerations

Design Guidelines

1.

This product is not designed to be electromagnetic- and ionized-particle-radiation resistant.

■ Manufacturing Guidelines

Soldering Instructions

1.

Sharp recommends soldering no more than once when using solder reflow methods.

2.

When using solder reflow methods, follow the reflow soldering temperature profile shown in Fig. 4. Sharp rec-

ommends checking the process to make sure these parameters are not exceeded; exceeding these parameters

can cause substrate bending or other mechanical stresses leading to debonding of the internal gold wires, or

other similar failure modes.

3.

If using an infrared lamp to preheat the parts, such heat sources may cause localized high temperatures in the

part's resin. Be sure to keep the temperature profile within the guidelines shown in Fig. 4.

4.

If hand soldering, use temperatures

≤260° for ≤3 seconds. Do not dip-solder or VPS-solder this part.

5.

Do not subject the package to excessive mechanical force during soldering as it may cause deformation or

defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-

age due to the PCB flexing during the soldering process.

Fig. 3 Radiation Diagram (TYP.)

-30°

-40°

-50°

-60°

-70°

-80°

-90°

+30°

+40°

+50°

+60°

+70°

+80°

+90°

Cathode

Anode

-90°

+90°

0°

0

20

40

60

80

100

Angular Displacement

θ

-20°

-10°

0°

+10°

+20°

Ta = 25°C