Sheet No.: D1-A00301EN

5

PD100MF0MPx

Cleaning Instructions

1.

Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the

optical characteristics.

2.

Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.

3.

Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning

time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-

tions to confirm the harmlessness of the ultrasonic cleaning methods.

4.

Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.

Storage and Handling

1.

Store these parts between 5°C and 30°C, at a relative humidity of less than 70%.

2.

After breaking the package seal, maintain the environment within 5°C to 25°C, at a relative humidity of less than

60%, and mount the parts within two days.

3.

When storing the parts after breaking the seal, Sharp recommends storage of no longer than two weeks in a dry

box or by resealing the parts in a moisture-proof bag with a desiccant. If unable to do so, bake before mounting.

4.

When baking the parts before mounting, Sharp recommends baking the parts only once and only if in a metal

tray or mounted on a PCB. Recommended conditions are for 16 to 24 hours, at a temperature of 125°C.

Fig. 4 Reflow Soldering Temperature Profile

200°C

25°C

240°C MAX.

120s MAX.

90s MAX.

60s MAX.

10s MAX.

165°C MAX.

1 to 4°C/s

1 to 4°C/s

1 to 4°C/s