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UBA2015AP 数据表(PDF) 19 Page - NXP Semiconductors |
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UBA2015AP 数据表(HTML) 19 Page - NXP Semiconductors |
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19 / 42 page ![]() UBA2016A_15_15A All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Objective data sheet Rev. 1 — 20 May 2011 19 of 42 NXP Semiconductors UBA2016A/15/15A 600 V fluorescent lamp driver A programmable end-of-life window is achieved by the internal bias current sink Ibias(EOL). The effective relative size of the EOL window will decrease in line with the increasing series resistance connected to pin EOL. The end-of-life lamp rectifying detection is only active during the Burn state. 7.6.2 End-of-life overvoltage detection This protection is intended to protect against symmetrical lamp aging. When in Burn state the voltage on pin VFB exceeds the overvoltage end-of-life threshold voltage Vth(oveol)(VFB) by more then 50 % of each switching cycle the fault timer will start. Vth(oveol)(VFB) is related to the regulation voltage on pin IFB Vreg(IFB) that itself is dependent on the voltage on pin DIM (see Section 7.4.7.1 “Lamp current control and dimming”) according to the formula: Vth(oveol)(VFB) =a − b × Vreg(IFB) Parameters a and b can be calculated from the Vth(oveol)(VFB) values given in Table 6. The end-of-life overvoltage protection is only active during Burn state and (for UBA2015A and UBA2016A) if the voltage at pin DIM is above the overvoltage end-of-life enable voltage Ven(oveol)(DIM). 7.6.3 Capacitive mode detection Under all normal operating conditions the half-bridge switching frequency should be higher than the load resonance frequency. The load then shows an inductive behavior in that the load current Iload lags behind the half-bridge voltage VSHHB. If the amplitude and the phase difference are large enough, the load current will charge any capacitance on pin SHHB during the non-overlap time tno(LH), and discharge it during the other non-overlap time tno(HL). As a result the voltage across the switches is almost zero at the moment they turn on. This is called zero voltage switching; see Figure 14 “Switching”. Zero voltage switching provides the highest switching efficiency and the least Electromagnetic Emission (EME). Capacitive mode switching can occur when, due to any abnormal condition, the switching frequency is below the load resonance frequency. This can happen when the lamp is removed. The load current will then keep the backgate diode of the switch that is switched off conducting during the non-overlap time, and if the other switch is turned on, a sudden step of the half-bridge voltage to the other supply rail takes place (which causes huge current spikes). Also cross conduction between the switches can occur during the reverse recovery of the backgate diode. These effects put huge stress on the power switches, most of which can only handle capacitive mode switching a few times before they break down. To protect against capacitive mode switching the IC monitors pin SHHB during the non-overlap time tno(LH) between switching off of the low-side switch and switching on of the high-side switch. If a rise of VSHHB (dVSHHB/dt > Vth(cm)(SHHB)) during tno(LH) is not detected then the IC will conclude that capacitive mode switching is occurring during the next full cycle. If capacitive mode is detected longer than the fault activation delay time tdet(fault) then the IC will enter Stop state. Capacitive mode detection is active in all oscillating states for all ICs except in the Ignition state of the UBA2016A if zero voltage switching has been observed. In that case the UBA2016A switches to hard switching regulation, see Section 7.6.4 “Hard switching regulation (UBA2016A)”. |
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