PCF8564A datasheet(32/45 Pages) NXP

32 / 45 page

PCF8564A

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 02 — 30 September 2010

32 of 45

NXP Semiconductors

PCF8564A

Real time clock and calendar

Table 31.

Bonding pad description for all PCF8564AU types

All x/y coordinates represent the position of the center of each pad with respect to the center

(x/y = 0) of the chip; see Figure 27.

Symbol

Pad

X (

μm)

Y (

μm)

Description

OSCI

−523.0

689.4

oscillator input

OSCO

−523.0

469.4

oscillator output

INT

−523.0

−429.8

open-drain interrupt output (active LOW)

VSS

−523.0

−684.4

ground (substrate)

SDA

524.9

−523.8

serial data I/O

SCL

524.9

−138.6

serial clock input

CLKOUT

524.9

162.5

CMOS push-pull clock output

VDD

524.9

443.3

supply

CLKOE

524.9

716.3

CLKOUT output enable

Fig 28. Bare die outline of PCF8564ACX9

References

Outline

version

European

projection

Issue date

IEC

JEDEC

JEITA

PCF8564ACX9

pcf8564acx9_po

09-08-25

09-09-09

Unit

max

nom

min

0.29

0.09

0.2

1.27

1.9

0.73

0.27

Dimensions

Note

1. Chip dimensions including sawline.

2. Marking code: PC8564A-1

WLCSP9: wafer level chip-size package; 9 bumps; 1.27 x 1.9 x 0.29 mm

PCF8564ACX9

0.2

bD(1)

E(1)

ee1

0.45

0.5

1 mm

scale

(2)

detail X

0,0

PCF8564A 数据表(PDF) 32 Page - NXP Semiconductors

PCF8564A 数据表(HTML) 32 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45

数据表下载

链接网址

PCF8564A 数据表(PDF) 32 Page - NXP Semiconductors

PCF8564A 数据表(HTML) 32 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45

数据表 下载

链接网址

数据表下载