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L6228Q 数据表(PDF) 28 Page - STMicroelectronics |
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L6228Q 数据表(HTML) 28 Page - STMicroelectronics |
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28 / 32 page ![]() Package mechanical data L6228Q 28/32 Doc ID 14321 Rev 4 8 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Note: VFQFPN stands for thermally enhanced very thin profile fine pitch quad flat package no lead. Very thin profile: 0.80 < A < 1.00 mm. Details of terminal 1 are optional but must be located on the top surface of the package by using either a mold or marked features. Table 8. VFQFPN32 5x5x1.0 pitch 0.50 Dim. Databook (mm) Min Typ Max A 0.80 0.85 0.95 b 0.18 0.25 0.30 b1 0.165 0.175 0.185 D 4.85 5.00 5.15 D2 3.00 3.10 3.20 D3 1.10 1.20 1.30 E 4.85 5.00 5.15 E2 4.20 4.30 4.40 E3 0.60 0.70 0.80 e0.50 L 0.30 0.40 0.50 ddd 0.08 |
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