DL4 datasheet(65/76 Pages) ITT

65 / 76 page

Dimensions are shown in mm (inch)

Dimensions subject to change

ZIF Connectors

DL/DLM/DLD

PCB Pad Layout

For the PC/RC Versions; The contact tail design

has been modified from a 0,64 (.025) square pin to

a 0,05 (.020) diameter round pin. The change

enables a decrease in the diameter of the through-

holes as well as the solder mounds on PCB’s (d1,

and d2 can be wider than D1 and D2). This can

reduce the crosstalk in RF circuits and enhance the

dielectric withstanding voltage in high voltage

circuits.

Dimensions

1,14 (.045)

0,47 (.018)

1,44 (.057)

0,62 (.024)

PCB Pad Layout

The soldering of contacts into through (THRU)

holes on a PC Board has become standard for

medical equipment and test equipment for semi-

conductors. As a result of the narrow spacing

between the solder pad and circuit pattern,

crosstalk between signals increases. A solution to

this problem is to make the diameter of the

contacts and solder lands smaller to provide more

space between the lands and the patterns.

However, a smaller diameter contact results in

higher impedance.

Cannon designed a solution with a smaller

diameter contact tail. This design application

allows the use of a smaller through-hole diameter.

CONTACT

SOLDER

THRU HOLE

PC TAIL

PCB

CONNECTOR

INSULATOR

DL4 数据表(PDF) 65 Page - ITT Industries

DL4 数据表(HTML) 65 Page - ITT Industries

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