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ZXGD3105 数据表(PDF) 3 Page - Diodes Incorporated

部件名 ZXGD3105
功能描述  Low standby power with quiescent supply current < 1mA
PDF  13 Pages
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制造商  DIODES [Diodes Incorporated]
网页  http://www.diodes.com
标志 DIODES - Diodes Incorporated

ZXGD3105 数据表(HTML) 3 Page - Diodes Incorporated

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ZXGD3105N8
Document Number DS35101 Rev. 1 – 2
3 of 13
www.diodes.com
November 2011
© Diodes Incorporated
A Product Line of
Diodes Incorporated
ZXGD3105N8
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Supply voltage, relative to GND
VCC
15
V
Drain pin voltage
VD
-3 to 100
V
Gate output voltage
VG
-3 to VCC + 3
V
Gate Driver peak source current
ISOURCE
4
A
Gate Driver peak sink current
ISINK
9
A
Reference voltage
VREF
VCC
V
Reference current
IREF
25
mA
Bias voltage
VBIAS
VCC
V
Bias current
IBIAS
100
mA
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Power Dissipation
Linear derating factor
(Note 4)
PD
490
3.92
mW
mW/
°C
(Note 5)
655
5.24
(Note 6)
720
5.76
(Note 7)
785
6.28
Thermal Resistance, Junction to Ambient
(Note 4)
RθJA
255
°C/W
(Note 5)
191
(Note 6)
173
(Note 7)
159
Thermal Resistance, Junction to Lead
(Note 8)
RθJL
135
°C/W
Operating Temperature Range
TJ
-40 to +150
°C
Storage Temperature Range
TSTG
-50 to +150
Notes:
4. For a device surface mounted on minimum recommended pad layout FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the
device is measured when operating in a steady-state condition.
5. Same as note (4), except pin 1 (VCC) and pin 7 (GND) are both connected to separate 5mm x 5mm 1oz copper heatsinks.
6. Same as note (5), except both heatsinks are 10mm x 10mm.
7. Same as note (5), except both heatsinks are 15mm x 15mm.
8. Thermal resistance from junction to solder-point at the end of each lead on pin 1 (VCC) and pin 7 (GND).



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