ADP198

Data Sheet

Rev. D | Page 16 of 16

PACKAGING AND ORDERING INFORMATION

OUTLINE DIMENSIONS

0.990

0.950

0.910

1.065

1.025

0.985

BOTTOM VIEW

(BALL SIDE UP)

TOP VIEW

(BALL SIDE DOWN)

A

1

2

B

BALL A1

IDENTIFIER

0.50

REF

0.640

0.595

0.550

END VIEW

0.340

0.320

0.300

0.370

0.355

0.340

SEATING

PLANE

0.270

0.240

0.210

COPLANARITY

0.05

Figure 33. 4-Ball Wafer Level Chip Scale Package [WLCSP]

(CB-4-4)

Dimensions shown in millimeters

1.70

1.60

1.50

0.425

0.350

0.275

TOP VIEW

8

1

5

4

0.30

0.25

0.20

BOTTOM VIEW

PIN 1 INDEX

AREA

2.00

BSC SQ

SEATING

PLANE

0.60

0.55

0.50

1.10

1.00

0.90

0.20 REF

0.175 REF

0.05 MAX

0.02 NOM

0.50 BSC

EXPOSED

PAD

PIN 1

INDICATOR

(R 0.15)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 34. 8-Lead Lead Frame Chip Scale Package [LFCSP_UD]

2.00 × 2.00 mm Body, Ultra Thin, Dual Lead

(CP-8-10)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature

Range

Start-Up

Time (μs)

Package Description

Package

Option

Branding

ADP198ACBZ-R7

−40°C to +85°C

30

4-Ball Wafer Level Chip Scale Package [WLCSP]

CB-4-4

8C

ADP198ACBZ-11-R7

−40°C to +85°C

1000

4-Ball Wafer Level Chip Scale Package [WLCSP]

CB-4-4

2W

ADP198ACPZ-R7

−40°C to +85°C

Pin selectable:

30, 200, 450,

and 1000

8-Lead Lead Frame Chip Scale Package [LFCSP_UD]

CP-8-10

LJL

ADP198CP-EVALZ

Evaluation Board

©2011–2012 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D09484-0-6/12(D)

www.analog.com/ADP198