ADP1876ACPZ-R7 datasheet(24/24 Pages) AD

24 / 24 page

ADP1876

Data Sheet

Rev. A | Page 24 of 24

PACKAGING AND ORDERING INFORMATION

OUTLINE DIMENSIONS

Figure 34. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

5 mm × 5 mm Body, Very Thin Quad

(CP-32-11)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

ADP1876ACPZ-R7

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-32-11

ADP1876-EVALZ

Evaluation Board

1 Z = RoHS Compliant Part.

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

EXPOSED

PAD

PIN 1

INDICATOR

3.65

3.50 SQ

3.45

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.25 MIN

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D10103-0-11/11(A)

ADP1876ACPZ-R7 数据表(PDF) 24 Page - Analog Devices

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