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ADP2370ACPZ-5.0-R7 数据表(PDF) 7 Page - Analog Devices |
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ADP2370ACPZ-5.0-R7 数据表(HTML) 7 Page - Analog Devices |
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7 / 32 page ![]() Data Sheet ADP2370/ADP2371 Rev. A | Page 7 of 32 PIN CONFIGURATION AND FUNCTION DESCRIPTIONS ADP2370/ADP2371 TOP VIEW (Not to Scale) 3 EN 4 SYNC 1 VIN NOTES 1. THE EXPOSED PAD ON THE BOTTOM OF THE PACKAGE ENHANCES THE THERMAL PERFORMANCE AND IS ELECTRICALLY CONNECTED TO GROUND INSIDE THE PACKAGE. THE EXPOSED PAD MUST BE CONNECTED TO THE GROUND PLANE ON THE CIRCUIT BOARD FOR PROPER OPERATION. 2 FSEL 6 PG 5 FB 8 PGND 7 SW Figure 2. Pin Configuration Table 5. Pin Function Descriptions Pin No. Mnemonic Description 1 VIN Power Input. 2 FSEL Frequency Select. High = 1.2 MHz, low = 600 kHz. 3 EN Enable. Enable input with precision thresholds. 4 SYNC Synchronize. This pin is used to synchronize the device to an external 600 kHz to 1.2 MHz clock or forces PWM mode when it is held high. SYNC held low forces automatic PWM/PSM operation. 5 FB Feedback. This pin provides feedback from the output. 6 PG Power Good. PG is an open-drain output. 7 SW Switch. This pin serves as the connection from the power MOSFETs to the inductor. 8 PGND Power Ground. EPAD Exposed Pad. The exposed pad on the bottom of the package enhances the thermal performance and is electrically connected to ground inside the package. The exposed pad must be connected to the ground plane on the circuit board for proper operation. |
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