ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.

These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave

soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming

Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

AP02001 Rev. 52

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Suggested Pad Layout

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W-DFN3020-8

Type K

Dimensions

Value

(in mm)

C

0.650

X

0.600

X1

0.400

X2

0.825

X3

0.675

X4

1.250

X5

2.750

Y

0.675

Y1

0.550

Y2

0.850

Y3

0.755

Y4

1.455

Y5

1.000

Y6

0.650

Y7

1.455

Y8

2.300

U-DFN3020-8

Type E

Dimensions

Value

(in mm)

C

0.650

G

0.200

G1

0.150

X

0.400

X1

1.100

X2

1.100

Y

0.550

Y1

0.900

Y2

0.900

Y3

2.300

C

X (8x)

Y (8x)

X1

Y1

X2

Y2

G

G1

Y3

X1 (6x)

Y1

Y (4x)

Y3

X2

Y7

Y6

X4

X3

Y5

Y4

X (2x)

C

Y2

Y8

X5