ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.

These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave

soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming

Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

AP02001 Rev. 52

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Suggested Pad Layout

© Diodes Incorporated

U-DFN1616-6

X1-DFN1616-6 Type E

Dimensions Value (in mm)

Z

1.3

G

0.175

X1

0.50

X2

0.525

Y

0.30

C

0.50

Dimensions

Value

(in mm)

C

0.500

X

0.300

X1

0.200

X2

0.720

X3

0.400

Y

0.475

Y1

0.620

Y2

1.900

U-DFN1616-8

Dimensions Value (in mm)

G1

0.15

G2

0.20

X1

0.65

X2

0.25

Y1

1.25

Y2

0.50

C

0.40

a

0.10

U-DFN2018-6

Dimensions

Value (in mm)

C

0.50

G

0.20

X

0.25

X1

1.60

Y

0.35

Y1

1.20

X1

G

X2

Z

C

Y

X (6x)

C

Y (2x)

Y2

X1

Y1

X2

X3

G1

Y2

Y1

C

X1

X2

G2

a

Y

XC

X1

G

Y1