ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.

These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave

soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming

Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

AP02001 Rev. 52

23 of 27

www.diodes.com

Suggested Pad Layout

© Diodes Incorporated

TSSOP-16EP

Dimensions

Value

(in mm)

C

0.650

X

0.450

X1

3.290

X2

5.000

Y

1.450

Y1

3.290

Y2

4.450

Y3

7.350

TSSOP-20

Dimensions

Value

(in mm)

C

0.650

X

0.420

X1

6.270

Y

1.780

Y1

4.160

Y2

7.720

TSSOP-20EP

Dimensions

Value

(in mm)

C

0.650

X

0.420

X1

4.490

X2

6.270

Y

1.780

Y1

3.290

Y2

4.160

Y3

7.720

Y2

Y (16x)

Y3

C

Y1

X2

X1

X (16x)

Y1

Y2

Y (20x)

X (20x)

C

X1

Y1

X1

Y2

Y3

Y (20x)

X (20x)

C

X2