Characteristics

STTH102-Y

4/7

Doc ID 17982 Rev 1

Figure 7.

(90% confidence)

Figure 8.

Reverse recovery charges versus

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

1

10

100

1000

I

(A)

RM

dI /dt(A/µs)

F

I =1A

F

V =100V

T =125°C

R

j

T =125°C

j

T =25°C

j

0.0

2.5

5.0

7.5

10.0

12.5

15.0

17.5

20.0

22.5

25.0

27.5

30.0

32.5

35.0

1

10

100

1000

Q (nC)

rr

dI /dt(A/µs)

F

I =1A

F

V =100V

R

T =125°C

j

T =25°C

j

Figure 9.

Relative variations of dynamic

parameters versus junction

temperature

Figure 10.

Thermal resistance junction to

ambient versus copper surface

under each lead

1.0

1.5

2.0

2.5

3.0

3.5

25

50

75

100

125

150

175

I; t ; Q

[T ] /

RM

rr

rr

j

I

; t ; Q

[T =25°C]

RM

rr

rr

j

T (°C)

j

I=I

dI /dt=200A/µs

F

F(AV)

F

V =100V

R

0

10

20

30

40

50

60

70

80

90

100

110

120

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

R

(°C/W)

th(j-a)

S(cm²)

Epoxy printed circuit board FR4, copper thickness: 35 µm