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VNH7013XP-E 数据表(PDF) 19 Page - STMicroelectronics |
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VNH7013XP-E 数据表(HTML) 19 Page - STMicroelectronics |
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19 / 24 page ![]() VNH7013XP-E Package and PCB thermal data Doc ID 022370 Rev 3 19/24 Figure 17. Thermal fitting model of an H-bridge in PowerSSO-36 Table 15. Thermal parameters(1) 1. The blank space means that the value is the same as the previous one. Area/island (cm2) Footprint 2 8 4L R1 = R7 (°C/W) 0.2 R2 = R8 (°C/W) 1.6 R3 (°C/W) 8 R4 (°C/W) 30 16 16 10 R5 (°C/W) 40 22 12 5 R6 (°C/W) 36 28 10 6 R9 = R15 (°C/W) 0.1 R10 = R16 (°C/W) 2.8 R11 = R17 (°C/W) 22 14 14 14 R12 = R18 (°C/W) 49 30 30 20 R13 = R19 (°C/W) 52 36 28 16 R14 = R20 (°C/W) 50 32 26 18 R21 = R22 (°C/W) 80 60 50 40 R23 (°C/W) 80 50 45 30 C1 = C7 = C9 = C15 (W.s/°C) 0.001 C2 = C8 (W.s/°C) 0.009 C3 (W.s/°C) 0.09 C4 (W.s/°C) 0.5 0.8 0.8 0.8 C5 (W.s/°C) 0.8 1.4 2 3 C6 (W.s/°C) 5 6 8 10 C10 = C16 (W.s/°C) 0.1 C11 = C17 (W.s/°C) 0.07 C12 = C18 (W.s/°C) 0.45 0.45 0.45 0.6 C13 = C19 (W.s/°C) 0.8 1 1.2 2.5 C14 = C20 (W.s/°C) 4 5 6 8 C21 = C22 = C23 (W.s/°C) 0.01 0.006 0.005 0.005 |
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