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ICX205AL

b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the

package may fracture, etc., depending on the flatness of the ceramic portions. Therefore, for installation,

use either an elastic load, such as a spring plate, or an adhesive.

c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated

voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area,

and indicated values should be transferred to other locations as a precaution.

d) The upper and lower ceramic are joined by low melting point glass. Therefore, care should be taken not

to perform the following actions as this may cause cracks.

• Applying repeated bending stress to the outer leads.

• Heating the outer leads for an extended period with a soldering iron.

• Rapidly cooling or heating the package.

• Applying any load or impact to a limited portion of the low melting point glass using tweezers or other

sharp tools.

• Prying at the upper or lower ceramic using the low melting point glass as a fulcrum.

Note that the same cautions also apply when removing soldered products from boards.

e) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyano-

acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives.

(reference)

5) Others

a) Do not expose to strong light (sun rays) for long periods. For continuous using under cruel condition

exceeding the normal using condition, consult our company.

b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or

usage in such conditions.