AS-Interface Slave IC

AS2702 (SAP4.1)

Rev. C, January 2001

Page 4 of 18

to neg. AS-interface bus line;

ground reference.

11

9

LTGP

I, power

Pos. supply pin, connected

to pos. AS-interface bus line

12

10

CDC

I/O, analog

Pin for ext. buffer capacitor

13

11

UOUT

O, power

Nom. 24V power supply output

14

12

PFAULT I, digital, pull-

up

1

Low-active input to flag failure

of the sensors / actuators circuitry con-

nected

15

13

LED2

I/O, digital,

pull-up

1

LED output 2 (IC test input)

16

14

PSTBn

I/O, digital,

pull-up

1

Parameter port strobe output

(IC test input)

17

15

D3

I/O, digital

Bidir. data port bit 3

18

16

D2

I/O, digital

Bidir. data port bit 2

19

--

P3

I/O, digital,

pull-up

1, 2

Bidir. parameter port bit 3

20

--

P2

I/O, digital,

pull-up

1, 2

Bidir. parameter port bit 2

Notes:

1

The pull-up structure is a passive high-side current source with a nom. 10 µA current

2

The passive pull-up current source as per note 1 on these parameter port pins is off,

if the slave device is programmed with I/O-configuration code 7 and a master data

call is present

)XQFWLRQDOHOHFWULFDODQGWLPLQJFKDUDFWHULV

WLFV

All voltages are referenced to ground pin LTGN. Timing is valid for a quartz crystal frequency

of 5.333 MHz.

a) Absolute maximum ratings

6\PERO 3DUDPHWHU

0LQ

0D[

8QLW

1RWH

VLTGP

Voltage at the positive supply pin

- 0.3

40

V

1

VCDC

Volage at pin for ext. buffer capacitor

- 0.3

VLTGP +

0.3V

V

VU5R

Voltage at pins U5R, OSC1, OSC2

- 0.3

7

V

IIN

Input current at any pin, except for LTGP,

CDC

- 50

50

mA

2

ESD1

Electrostatic discharge voltage

1500

V

3

ESD2

Electrostatic discharge voltage

200

V

4

ΘSTG

Storage temperature

- 55

125

V

ΘLEAD Solder temperature

260

°C

5

PTOT

Max. power dissipation

1

W

6

RTHJA

Thermal resistance SOIC 16

61.2

74.8

°K / W

7

RTHJA

Thermal resistance SOIC 20

58.5

71.5

°K / W

7