AS-Interface Slave IC

AS2702 (SAP4.1)

Rev. C, January 2001

Page 5 of 18

Notes:

1

50 V during t > 50 µs; repetition rate < 0.5 Hz

2

Latch-up immunity test. Pls. observe max. power dissipation allowed.

3

Human body model: R = 1.5 kOhm; C = 100 pF

4

Machine model; applies only for LTGP-LTGN

5

260 °C during 10 s (reflow and wave soldering); 360 °C during 3 s for manual solder-

ing. Twofold reflow soldering is acceptable.

6

Free convection, see fig. 1

7

No forced cooling. PCB-surface: 21 cm2; still air volume around the device: 10 cm

3

Fig. 1: Max. acceptable power dissipation relative to ambient temperature

b) Recommended Operating Conditions

6\PERO

3DUDPHWHU

PLQ

QRP

PD[

8QLW

1RWH

VLTGP

Positive supply voltage / dc

portion

17.5

34

V

1

ILTG

Supply current consumption

6

mA

2

OA

Ambient temperature

- 25

25

85

°C

3

FC

Quartz frequency

5.3333

33

MHz

4

Sensitivity against moisture

5

Notes:

1

False-poling protection diode to be inserted between pos. AS-interface bus line and

LTGP-pin. LTGP-pin to be protected furthermore with a voltage clamp between

LTGP and LTGN.

2

Oscillator on; data transmission stage off; no loads connected

3

Power dissipation restrictions as per fig. 1 to be observed

4

ASI Quarz

5

Level 5 acc. to JEDEC-standard JESD22-A112, Table 1

1

0,5

50

100

t/ °C

Pv/ W

1

0,5

50

100

t/ °C

Pv/ W

62,&

62,&