ISM 868 MHz, 433 MHz and 315 MHz FSK Transmitter – Preliminary Data Sheet

ASCell3911

Rev. A, February 2000

Page 8 of 13

Austria Mikro Systeme International AG

5

GP

6

GP

Table 2:

Control bit description.

Single message transmission: After completing the data transmission to the ASCell3911, the

µC may indicate ”end of transmission” by setting P4 (not end of transmit) to ”L” and pulls the

WAKEUP line to ”L”. Sensing this, 4 clock cycles later the ASCell3911 will switch the µC back to

standby mode, disabling the µC_CLK output, setting the active WAKEUP pin to ”L”. The AS-

Cell3911 will finish the transmission sequence and than turning off the XTAL oscillator to and

goes back to the standby mode too. The SMT/CMT bit is ”L” indicates the single transmission

mode.

Note: SMT/CMT is one bit of the control information.

Continuous message transmission: After completing the data transmission to the AS-

Cell3911, the µC may indicate ”end of transmission” by setting P4 to ”L” and pulls the WAKEUP

line to ”L”. Sensing this, 4 clock cycles later the ASCell3911 will switch back to standby mode,

disabling the µC_CLK output, setting the active WAKEUP pin to ”L” and than turning off the XTAL

oscillator. The SMT/CMT bit is ”H” indicates the continuous transmission mode.

Note: SMT/CMT is one bit of the control information.

Due to the sophisticated tri-state - active/inactive pull-up configuration of the WAKEUP pin the

ASCell3911 does not drain current during its standby periods.

The interface implemented in the ASCell3911 system cell is a general, non-specialized example

only. It can be modified on customers demand.

2

Electrical Characteristics

2.1 Absolute Maximum Ratings (non operating)

Symbol

Parameter

Min

Max

Units

Note

VDD; VDDSYN

Positive supply voltage

-0,5

6

V

GND; GNDSYN

Negative supply voltage

0

0

V

Vin

Voltage at every input pin

Gnd-0,5

VCC+0,5

V

Iin

Input current into any pin except

supply pins

-10

10

mA

Latch-up Test

ESD

Electrostatic discharge

1k

V

1) 3)

Electrostatic discharge of RF pins

500

V

1) 4)

Tstg

Storage temperature

-55

125

°C

Tlead

Lead temperature

260

°C

2)

1) Test according to MIL STD 883C, Method 3015.7. HBM: R=1,5 k

Ω, C=100 pF, 5 positive pulses per pin against supply pin(s), 5

negative pulses per pin against supply pin(s).

2) 260 °C for 10 s (Reflow and Wave Soldering), 360 °C for 3 s (Manual soldering).

3) All pins except RF+, RF-, XTAL.

4) Pins RF+, RF-, XTAL.