AD9283

–10–

REV. B

Figure 24. Printed Circuit Board Ground Layer

Figure 25. Printed Circuit Board Bottom Side Copper

EVALUATION BOARD BILL OF MATERIALS — GS01717

#

QTY

REFDES

DEVICE

PACKAGE

VALUE

1

15

C1, C4–C17

Ceramic Cap

0603

0.1

µF

2

4

C18–C21

Tantalum Cap

BCAPTAJD

10

µF

3

24

E1–E6, E8–E10, E12–E19,

E21, E34–E39

W-HOLE

4

4

J1, J2, J3, J5

Connector

SMB

5

1

P1

5-Pin Connector

Wieland Connector

(P/N #25.602.2553.0 Top

P/N #Z5.530.0525.0 Bottom)

6

1

P2

37-Pin Connector

AMP-747462-2

7

5

R4, R9, R10, R21, R22

Resistor

1206

50

8

1

R7

Resistor

1206

25

9

1

R23

Resistor

1206

2K

10

1

T1

Transformer

Mini-Circuits T1-1T-KK81

11

1

U1

AD9283

SSOP-20

12

1

U3

AD9760

SOIC-28

13

1

U4

74ACQ574

SOIC-20

14

1

U5

SN74LVC86

SO14