PCAL9554B_PCAL9554C

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© NXP B.V. 2012. All rights reserved.

Product data sheet

Rev. 2 — 10 December 2012

21 of 42

NXP Semiconductors

PCAL9554B; PCAL9554C

9.

Limiting values

[1]

The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

10. Recommended operating conditions

11. Thermal characteristics

[1]

The package thermal impedance is calculated in accordance with JESD 51-7.

Table 19.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

supply voltage

0.5

+6.5

V

input voltage

[1]

0.5

+6.5

V

output voltage

[1]

0.5

+6.5

V

input clamping current

-

20

mA

output clamping current

-

20

mA

input/output clamping current

-

20

mA

-

20

mA

LOW-level output current

continuous; I/O port

-

50

mA

continuous; SDA, INT

-25

mA

HIGH-level output current

continuous; P port

-

25

mA

supply current

-

160

mA

ground supply current

-

200

mA

total power dissipation

-

200

mW

storage temperature

65

+150

C

maximum junction temperature

-

125

C

Table 20.

Operating conditions

Symbol

Parameter

Conditions

Min

Max

Unit

supply voltage

1.65

5.5

V

HIGH-level input voltage

SCL, SDA

0.7

 V

DD

5.5

V

A0, A1, A2, P port

0.7

 V

DD

5.5

V

LOW-level input voltage

SCL, SDA

0.5

0.3

 V

DD

V

A0, A1, A2, P port

0.5

0.3

 V

DD

V

HIGH-level output current

P port

-

10

mA

LOW-level output current

P port

-

25

mA

ambient temperature

operating in free air

40

+85

C

Table 21.

Thermal characteristics

Symbol

Parameter

Conditions

Max

Unit

transient thermal impedance from junction to ambient

HVQFN16 package

[1] 53

K/W

TSSOP16 package

[1] 108

K/W