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LCMXO2-256ZE-2TG100C 数据表(PDF) 27 Page - Lattice Semiconductor |
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LCMXO2-256ZE-2TG100C 数据表(HTML) 27 Page - Lattice Semiconductor |
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27 / 106 page ![]() 2-23 Architecture MachXO2 Family Data Sheet and differential input termination. The PCI clamp is enabled after VCC and VCCIO are at valid operating levels and the device has been configured. 3. Top sysIO Buffer Pairs The sysIO buffer pairs in the top bank of the device consist of two single-ended output drivers and two single- ended input buffers (for ratioed inputs such as LVCMOS and LVTTL). The I/O pairs on the top also have differ- ential and referenced I/O buffers. Half of the sysIO buffer pairs on the top edge have true differential outputs. The sysIO buffer pair comprising of the A and B PIOs in every PIC on the top edge have a differential output driver. The referenced input buffer can also be configured as a differential input buffer. Typical I/O Behavior During Power-up The internal power-on-reset (POR) signal is deactivated when VCC and VCCIO0 have reached VPORUP level defined in the Power-On-Reset Voltage table in the DC and Switching Characteristics section of this data sheet. After the POR signal is deactivated, the FPGA core logic becomes active. It is the user’s responsibility to ensure that all VCCIO banks are active with valid input logic levels to properly control the output logic states of all the I/O banks that are critical to the application. The default configuration of the I/O pins in a blank device is tri-state with a weak pull- down to GND (some pins such as PROGRAMN and the JTAG pins have weak pull-up to VCCIO as the default func- tionality). The I/O pins will maintain the blank configuration until VCC and VCCIO (for I/O banks containing configura- tion I/Os) have reached VPORUP levels at which time the I/Os will take on the user-configured settings only after a proper download/configuration. There are various ways a user can ensure that there are no spurious signals on critical outputs as the device pow- ers up. These are discussed in more detail in TN1202, MachXO2 sysIO Usage Guide. Supported Standards The MachXO2 sysIO buffer supports both single-ended and differential standards. Single-ended standards can be further subdivided into LVCMOS, LVTTL, and PCI. The buffer supports the LVTTL, PCI, LVCMOS 1.2, 1.5, 1.8, 2.5, and 3.3V standards. In the LVCMOS and LVTTL modes, the buffer has individually configurable options for drive strength, bus maintenance (weak pull-up, weak pull-down, bus-keeper latch or none) and open drain. BLVDS, MLVDS and LVPECL output emulation is supported on all devices. The MachXO2-640U, MachXO2-1200/U and higher devices support on-chip LVDS output buffers on approximately 50% of the I/Os on the top bank. Differential receivers for LVDS, BLVDS, MLVDS and LVPECL are supported on all banks of MachXO2 devices. PCI support is provided in the bottom bank of theMachXO2-640U, MachXO2-1200/U and higher density devices. Table 2-11 sum- marizes the I/O characteristics of the MachXO2 PLDs. Tables 2-11 and 2-12 show the I/O standards (together with their supply and reference voltages) supported by the MachXO2 devices. For further information on utilizing the sysIO buffer to support a variety of standards please see TN1202, MachXO2 sysIO Usage Guide. Table 2-11. I/O Support Device by Device MachXO2-256, MachXO2-640 MachXO2-640U, MachXO2-1200 MachXO2-1200U MachXO2-2000/U, MachXO2-4000, MachXO2-7000 Number of I/O Banks 4 4 6 Type of Input Buffers Single-ended (all I/O banks) Differential Receivers (all I/O banks) Single-ended (all I/O banks) Differential Receivers (all I/O banks) Differential input termination (bottom side) Single-ended (all I/O banks) Differential Receivers (all I/O banks) Differential input termination (bottom side) |
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