TMP35/TMP36/TMP37

Rev. F | Page 4 of 20

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter1, 2

Rating

Supply Voltage

7 V

Shutdown Pin

Output Pin

Operating Temperature Range

−55°C to +150°C

Die Junction Temperature

175°C

Storage Temperature Range

−65°C to +160°C

IR Reflow Soldering

Peak Temperature

220°C (0°C/5°C)

Time at Peak Temperature Range

10 sec to 20 sec

Ramp-Up Rate

3°C/sec

Ramp-Down Rate

−6°C/sec

Time 25°C to Peak Temperature

6 min

IR Reflow Soldering—Pb-Free Package

Peak Temperature

260°C (0°C)

Time at Peak Temperature Range

20 sec to 40 sec

Ramp-Up Rate

3°C/sec

Ramp-Down Rate

−6°C/sec

Time 25°C to Peak Temperature

8 min

unprotected units from high energy electrostatic fields. Keep units in

conductive foam or packaging at all times until ready to use. Use proper

antistatic handling procedures.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

socket.

Table 3. Thermal Resistance

Package Type

Unit

TO-92 (T-3)

162

120

°C/W

SOIC_N (R-8)

158

43

°C/W

SOT-23 (RJ-5)

300

180

°C/W

ESD CAUTION