TMP35/TMP36/TMP37

Rev. F | Page 7 of 20

TIME (s)

70

0

60

50

40

30

20

10

80

90

100

110

0

100

200

300

400

500

600

a

10mV

1ms

b

c

a. TMP35 SOIC SOLDERED TO 0.5" × 0.3" Cu PCB

b. TMP36 SOIC SOLDERED TO 0.6" × 0.4" Cu PCB

c. TMP35 TO-92 IN SOCKET SOLDERED TO

1" × 0.4" Cu PCB

100

90

10

0%

TIME/DIVISION

a

b

Figure 20. Temperature Sensor Wideband Output Noise Voltage;

Gain = 100, BW = 157 kHz

Figure 17. Thermal Response Time in Still Air

AIR VELOCITY (FPM)

0

60

40

20

80

140

100

120

0

100

200

300

400

500

600

a

FREQUENCY (Hz)

2400

1000

0

10

10k

100

1k

b

c

a. TMP35 SOIC SOLDERED TO 0.5" × 0.3" Cu PCB

b. TMP36 SOIC SOLDERED TO 0.6" × 0.4" Cu PCB

c. TMP35 TO-92 IN SOCKET SOLDERED TO

1" × 0.4" Cu PCB

700

2200

2000

1600

1800

1400

1200

800

600

400

200

a. TMP35/TMP36

b. TMP37

Figure 21. Voltage Noise Spectral Density vs. Frequency

Figure 18. Thermal Response Time Constant in Forced Air

TIME (s)

70

0

60

50

40

30

20

10

80

90

100

110

0

10

20

30

40

50

60

a

b

c

a. TMP35 SOIC SOLDERED TO 0.5" × 0.3" Cu PCB

b. TMP36 SOIC SOLDERED TO 0.6" × 0.4" Cu PCB

c. TMP35 TO-92 IN SOCKET SOLDERED TO

1" × 0.4" Cu PCB

Figure 19. Thermal Response Time in Stirred Oil Bath